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INTEGRATED CIRCUITS
DATA SHEET
74ALVCH162601 18-bit universal bus transceiver with 30 termination resistor; 3-state
Product specification File under Integrated Circuits, IC24 1999 Oct 14
Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
FEATURES * Complies with JEDEC standard no. 8-1A * CMOS low power consumption * Direct interface with TTL levels * MULTIBYTETM flow-through standard pin-out architecture * Low inductance multiple VCC and ground pins for minimum noise and ground bounce * All data inputs have bus hold circuitry * Integrated 30 termination resistors. DESCRIPTION
74ALVCH162601
The 74ALVCH162601 is an 18-bit universal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. Data flow in each direction is controlled by output enable (OEAB and OEBA), and clock (CPAB and CPBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is HIGH. When LEAB is LOW, the A data is latched if CPAB is held at a HIGH or LOW logic level. If LEAB is LOW, the A-bus data is stored in the latch/flip-flop on the LOW-to-HIGH transition of CPAB. When OEAB is LOW, the outputs are active. When OEAB is HIGH, the outputs are in the high-impedance state. The clocks can be controlled with the clock-enable inputs (CEBA/CEAB). Data flow for B-to-A is similar to that of A-to-B but uses OEBA, LEBA and CPBA. To ensure the high-impedance state during power-down, OEBA and OEAB should be tied to VCC through a pull-up resistor, the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. The 74ALVCH162601 is designed with 30 series resistors in both HIGH or LOW output stage. Active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
QUICK REFERENCE DATA Ground = 0; Tamb = 25 C; tr = tf = 2.5 ns. SYMBOL tPHL/tPLH CI/O CI CPD PARAMETER propagation delay An, Bn to Bn, An input/output capacitance input capacitance power dissipation capacitance per latch notes 1 and 2 outputs enabled outputs disabled Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. 21 3 pF pF CONDITIONS CL = 30 pF; VCC = 2.5 V CL = 50 pF; VCC = 3.3 V TYPICAL 4.0 3.1 8.0 4.0 ns ns pF pF UNIT
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
FUNCTION TABLE See note 1. INPUTS
74ALVCH162601
OUTPUTS CEXX X X X H L L L L Note 1. XX = AB for A-to-B direction, BA for B-to-A direction; H = HIGH voltage level; L = LOW voltage level; h = HIGH state must be present one set-up time before the LOW-to-HIGH transition of CPXX; l = LOW state must be present one set-up time before the LOW-to-HIGH transition of CPXX; X = don't care; = LOW-to-HIGH level transition; NC = no change; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGE TYPE NUMBER TEMPERATURE RANGE 74ALVCH162601DGG -40 to +85 C PINS 56 PACKAGE TSSOP MATERIAL plastic OEXX H L L L L L L L LEXX X H H L L L L L CPXX X X X X L H An, Bn X H L X h l X X Z H L NC H L NC
STATUS disabled transparent hold clock and display hold
CODE SOT364-1
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
PINNING PIN 1 2 OEAB LEAB SYMBOL
74ALVCH162601
DESCRIPTION output enable A-to-B latch enable A-to-B data inputs/outputs ground (0 V) DC supply voltage output enable B-to-A latch enable B-to-A clock enable B-to-A clock input B-to-A data inputs/outputs
3, 5, 6, 8, 9, 10, 12, 13, 14, 15, A0 to A17 16, 17, 19, 20, 21, 23, 24, 26 4, 11, 18, 25, 32, 39, 46, 53 7, 22, 35, 50 27 28 29 30 31, 33, 34, 36, 37, 38, 40, 41, 42, 43, 44, 45, 47, 48, 49, 51, 52, 54 55 56 GND VCC OEBA LEBA CEBA CPBA B17 to B0
CPAB CEAB
clock input A-to-B clock enable A-to-B
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
74ALVCH162601
handbook, halfpage
OEAB LEAB A0 GND A1 A2 VCC A3 A4
1 2 3 4 5 6 7 8 9
56 CEAB 55 CPAB 54 B0 53 GND 52 B1 51 B2 50 VCC 49 B3 48 B4 47 B5 46 GND 45 B6 44 B7 43 B8
MNA291
handbook, halfpage
VCC
data input
to internal circuit
A5 10 GND 11 A6 12 A7 13 A8 14
Fig.2 Bus hold circuit.
162601
A9 15 A10 16 A11 17 GND 18 A12 19 A13 20 A14 21 VCC 22 A15 23 A16 24 GND 25 A17 26 OEBA 27 LEBA 28
MNA287
42 B9 41 B10 40 B11 39 GND 38 B12 37 B13 36 B14 35 VCC 34 B15 33 B16 32 GND 31 B17 30 CPBA 29 CEBA
Fig.1 Pin configuration.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
74ALVCH162601
handbook, full pagewidth
OEAB CEAB LEAB CPAB CPBA LEBA CEBA OEBA
CE C1 CP An CE C1 CP 1D 18 IDENTICAL CHANNELS
MNA289
Bn
1D
Fig.3 Logic diagram (one section).
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
74ALVCH162601
handbook, halfpage
OEAB CEAB CPAB LEAB OEBA CEBA CPBA LEBA
1 56 55 2
EN1 G2 2C3 C3 G2 EN4 G5 5C6 C6 G5
handbook, halfpage
3 5 6 8 9 10 12 13
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 OEAB LEAB CPAB CEAB
B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 OEBA LEBA CPBA CEBA
MNA288
54 52 51 49 48 47 45 44 43 42 41 40 38 37 36 34 33 31
27 29 30 28
A0 A1 A2
3 5 6
3D 4
1 6D
54 52 51 49 48 47 45 44 43 42
B0 B1 B2 B3 B4 B5 B6 B7 B8
14 15 16 17 19 20 21 23 24 26
A3 8 9 A4 10 A5 12 A6 13 A7 14 A8 15 A9 16 A10 17 A11 19 A12 20 A13 21 A14 23 A15 24 A16 26 A17
B9 41 B10 40 B11 38 B12 37 B13 36 B14 34 B15 33 B16 31 B17
MNA290
1 2 55 56
27 28 30 29
Fig.4 IEC logic symbol.
Fig.5 Logic symbol.
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER DC supply voltage for max. speed performance for max. speed performance for low-voltage applications VI VO Tamb tr, tf DC input voltage DC output voltage operating ambient temperature input rise and fall times in free air VCC = 2.3 to 3.0 V VCC = 3.0 to 3.6 V LIMITING VALUES CL = 30 pF CL = 50 pF 2.3 3.0 1.2 0 0 -40 0 0 CONDITIONS MIN.
74ALVCH162601
TYP. 2.5 3.3 2.4 - - - - -
MAX. 2.7 3.6 3.6 VCC VCC +85 20 10
UNIT V V V V V C ns/V ns/V
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg Ptot Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 C the value of Ptot derates linearly with 8 mW/K. PARAMETER DC supply voltage DC input diode current DC input voltage DC output diode current DC output voltage DC output source or sink current DC VCC or GND current storage temperature power dissipation for temperature range: -40 to +125 C; note 2 VI < 0 note 1 VO > VCC or VO < 0 note 1 VO = 0 to VCC CONDITIONS MIN. -0.5 - -0.5 - -0.5 - - -65 - MAX. +4.6 -50 +4.6 50 50 100 +150 600 UNIT V mA V mA mA mA C mW
VCC + 0.5 V
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
DC CHARACTERISTICS Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL VIH VIL VOH PARAMETER VI (V) HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VIH or VIL IO = -100 A IO = -4 mA IO = -6 mA IO = -4 mA IO = -8 mA IO = -6 mA IO = -12 mA VOL LOW-level output voltage VIH or VIL IO = 100 A IO = 4 mA IO = 6 mA IO = 4 mA IO = 8 mA IO = 6 mA IO = 12 mA Il IOZ ICC ICC input leakage current 3-state output OFF-state current quiescent supply voltage VCC or GND VIH or VIL VCC or GND VO = VCC or GND IO = 0 IO = 0 OTHER VCC (V) 2.3 to 2.7 1.7 2.7 to 3.6 2.0 2.3 to 2.7 - 2.7 to 3.6 - 2.3 2.3 2.7 2.7 3.0 3.0 2.3 2.3 2.7 2.7 3.0 3.0
74ALVCH162601
Tamb = -40 TO +85 C MIN. TYP.(1) 1.2 1.5 1.2 1.5 MAX. - - 0.7 0.8 - - - - - - - 0.20 0.40 0.55 0.40 0.60 0.55 0.80 5 10 40 750
UNIT V V V
2.3 to 3.6 VCC - 0.2 VCC VCC - 0.4 VCC - 0.11 VCC - 0.6 VCC - 0.17 VCC - 0.5 VCC - 0.09 VCC - 0.7 VCC - 0.19 VCC - 0.6 VCC - 0.13 VCC - 1.0 VCC - 0.27 GND 0.07 0.11 0.06 0.13 0.09 0.19 0.1 0.1 0.2 150 - - - - - -
2.3 to 3.6 -
V
2.3 to 3.6 - 2.3 to 3.6 - 2.3 to 3.6 - 2.3 to 3.6 -
A A A A
additional quiescent supply VCC - 0.6 current given per data I/O pin with bus hold bus hold LOW sustaining current bus hold HIGH sustaining current bus hold LOW overdrive current bus hold LOW overdrive current 0.7(2) 0.8(2) 1.7(2) 2.0(2)
IBHL IBHH IBHLO IBHHO Notes
2.3(2) 3.0(2) 2.3(2) 3.0(2) 3.6(2) 3.6(2)
45 75 -45 -75 500 -500
- 150 -175 - -
- - - - - -
A A A A
1. All typical values are measured at Tamb = 25 C. 2. Valid for data inputs of bus hold parts.
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
AC CHARACTERISTICS FOR VCC = 2.3 TO 2.7 V Ground = 0 V; tr = tf 2.0 ns; CL = 30 pF. TEST CONDITIONS SYMBOL tPHL/tPLH PARAMETER WAVEFORMS propagation delay An, Bn to Bn, An propagation delay LEAB, LEBA to Bn, An propagation delay CPAB, CPBA to Bn, An tPZH/tPZL tPHZ/tPLZ tW 3-state output enable time OEAB, OEBA to Bn, An 3-state output disable time OEAB, OEBA to Bn, An see Figs 6 and 10 see Figs 7 and 10 see Figs 7 and 10 see Figs 8 and 10 see Figs 8 and 10 VCC (V)
74ALVCH162601
Tamb = -40 TO +85 C MIN. TYP.(1) 4.0 4.5 4.7 3.9 2.6 1.6 2.0 -0.2 0.1 -0.4 0.3 0.2 0.4 190 MAX. 5.3 6.0 6.4 6.1 5.7 - - - - - - - - -
UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns MHz
2.3 to 2.7 1.3 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 2.3 to 2.7 1.0 1.5 1.6 1.8 3.3 3.3 +2.3 1.3 +2.0 1.2 1.3 1.1 150
clock pulse width HIGH LEAB see Figs 7 and 10 or LEBA clock pulse width HIGH or LOW CPAB or CPBA see Figs 7 and 10 see Figs 9 and 10 see Figs 9 and 10
tsu
set-up time An, Bn to CPAB, CPBA set-up time An, Bn to LEAB, LEBA set-up time CEAB, CEBA to CPAB, CPBA
th
hold time An, Bn to CPAB, CPBA hold time An, Bn to LEAB, LEBA hold time CEAB, CEBA to CPAB, CPBA
see Figs 9 and 10 see Figs 9 and 10
2.3 to 2.7 2.3 to 2.7 2.3 to 2.7
fmax Note
maximum clock pulse frequency
see Figs 7 and 10
2.3 to 2.7
1. All typical values are measured at Tamb = 25 C and VCC = 2.5 V.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
AC CHARACTERISTICS FOR VCC = 2.7 V AND VCC = 3.0 TO 3.6 V Ground = 0 V; tr = tf 2.5 ns; CL = 50 pF. TEST CONDITIONS SYMBOL tPHL/tPLH PARAMETER WAVEFORMS propagation delay An, Bn to Bn, An propagation delay LEAB, LEBA to Bn, An propagation delay CPAB, CPBA to Bn, An tPZH/tPZL tPHZ/tPLZ tW 3-state output enable time OEAB, OEBA to Bn, An 3-state output disable time OEAB, OEBA to Bn, An clock pulse width LEAB, LEBA to CPAB, CPBA clock pulse width HIGH or LOW CPAB, CPBA tsu set-up time An, Bn to CPAB, CPBA set-up time An, Bn to LEAB, LEBA set-up time CEAB, CEBA to CPAB, CPBA th hold time An, Bn to CPAB, CPBA hold time An, Bn to LEAB, LEBA hold time CEAB, CEBA to CPAB, CPBA fmax maximum clock pulse frequency see Figs 7 and 10 see Figs 9 and 10 see Figs 9 and 10 see Figs 6 and 10 see Figs 7 and 10 see Figs 7 and 10 see Figs 8 and 10 see Figs 8 and 10 see Figs 7 and 10 see Figs 7 and 10 see Figs 9 and 10 see Figs 9 and 10 VCC (V) 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 2.7 3.0 to 3.6 - 1.6 - 1.5 - 1.6 - 1.6 - 1.8 3.3 3.3 3.3 3.3 2.4 +2.1 +1.2 1.1 +2.0 +1.7 1.1 +1.0 1.6 1.4 1.2 1.1 150 150
74ALVCH162601
Tamb = -40 TO +85 C MIN. TYP.(1) 3.9 3.1(2) 4.3 3.5(2) 4.5 3.7(2) 3.9 3.1(2) 3.2 2.9(2) 0.7 0.9(2) 1.2 0.9(2) 0.0 -0.2(2) -0.2 0.3(2) -0.7 -0.2(2) 0.3 -0.1(2) 0.1 0.1(2) 0.6 0.4(2) 190 240(2) MAX. 5.2 4.5 5.9 5.1 6.3 5.5 6.7 5.7 5.3 4.8 - - - - - - - - - - - - - - - - - -
UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns MHz
Notes 1. All typical values are measured at Tamb = 25 C. 2. Typical values at VCC = 3.3 V.
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
AC WAVEFORMS
74ALVCH162601
handbook, halfpage VI
An, Bn input GND tPHL VOH Bn, An output VOL
VM
tPLH
VM
MNA292
Fig.6 The input An, Bn to output Bn, An propagation delay times.
Notes: VCC = 2.3 to 2.7 V VM = 0.5VCC; VX = VOL + 150 mV; VY = VOH - 150 mV; VI = VCC; VOL and VOH are typical output voltage drop that occur with the output load. Notes: VCC = 3.0 to 3.6 V and VCC = 2.7 V VM = 1.5 V; VX = VOL + 300 mV; VY = VOH - 300 mV; VI = 2.7 V; VOL and VOH are typical output voltage drop that occur with the output load.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
74ALVCH162601
handbook, full pagewidth
1/fmax VI LEXX, CPXX input GND tW tPHL VOH Bn, An output VOL VM
MNA293
VM
VM
tPLH
Fig.7
Latch enable input LEAB, LEBA and clock input CPAB, CPBA to output Bn, An propagation delay times; pulse width and fmax of CPAB, CPBA.
handbook, full pagewidth
VI OEXX input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
MNA294
Fig.8 3-state enable and disable times.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
74ALVCH162601
handbook, full pagewidth
VI An, Bn input GND th tsu VI CPXX, LEXX input GND VM
MNA295
VM
th tsu
The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig.9 Data set-up and hold times for An and Bn inputs to LEAB, LEBA, CPAB or CPBA inputs.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO
RL 500
2 x VCC open GND
MNA296
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH
S1 open 2 x VCC GND VCC <2.7 V 2.7 to 3.6 V VI VCC 2.7 V
Definitions for test circuit. CL = load capacitance including jig and probe capacitance (See Chapter "AC characteristics"). RL = load resistance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.10 Load circuitry for switching times.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
PACKAGE OUTLINE TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
74ALVCH162601
SOT364-1
D
E
A X
c y HE vMA
Z
56
29
Q A2 A1 pin 1 index Lp L (A 3) A
1
e bp wM
28
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions). UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.85 A3 0.25 bp 0.28 0.17 c 0.2 0.1 D (1) 14.1 13.9 E (2) 6.2 6.0 e 0.5 HE 8.3 7.9 L 1.0 Lp 0.8 0.4 Q 0.50 0.35 v 0.25 w 0.08 y 0.1 Z 0.5 0.1 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT364-1 REFERENCES IEC JEDEC MO-153EE EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-02-03 95-02-10
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74ALVCH162601
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
74ALVCH162601
SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not REFLOW(1)
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
NOTES
74ALVCH162601
1999 Oct 14
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Philips Semiconductors
Product specification
18-bit universal bus transceiver with 30 termination resistor; 3-state
NOTES
74ALVCH162601
1999 Oct 14
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp20
Date of release: 1999
Oct 14
Document order number:
9397 750 05257

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